{"id":991,"date":"2023-07-27T09:58:45","date_gmt":"2023-07-27T01:58:45","guid":{"rendered":"https:\/\/tsmccenter.nycu.edu.tw\/?page_id=991"},"modified":"2023-07-27T09:59:17","modified_gmt":"2023-07-27T01:59:17","slug":"%e6%9c%aa%e4%be%86%e5%8d%8a%e5%b0%8e%e9%ab%94%e9%97%9c%e9%8d%b5%e6%8a%80%e8%a1%93%e7%a0%94%e7%a9%b6%e4%b8%ad%e5%bf%83","status":"publish","type":"page","link":"https:\/\/tsmccenter.nycu.edu.tw\/en\/%e7%a0%94%e7%a9%b6%e8%a8%88%e7%95%ab\/%e6%9c%aa%e4%be%86%e5%8d%8a%e5%b0%8e%e9%ab%94%e9%97%9c%e9%8d%b5%e6%8a%80%e8%a1%93%e7%a0%94%e7%a9%b6%e4%b8%ad%e5%bf%83\/","title":{"rendered":"Future Semiconductor Technologies Research Center"},"content":{"rendered":"
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R&D Programs<\/h2><\/div>
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Future Semiconductor Technologies Research Center<\/h1><\/div>

Future Semiconductor Technologies Research Center<\/h2><\/div>

Moderator\uff1aChenming Hu
\nInternational College of Semiconductor Technology, National Yang Ming Chiao Tung University<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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In the 2030s, the world will need zetta scale data centers, peta operations per\nsecond and per watt of AI capabilities, tera-hertz communication for 6G and\nsatellite communications, and compact and low-loss voltage\/power conversion.\nThese applications demand tremendous computing capabilities from\nsemiconductor devices and circuits in terms of transistor density, performance,\nenergy efficiency, and affordable cost. Fortunately, semiconductor thrives on\ninnovation since the invention of transistor 75 years ago. After half a century of\neffort and investment, Taiwan has become a semiconductor powerhouse and an\nimportant partner in the global semiconductor supply chain.\nFuture integrated circuit technology must evolve towards higher performance,\nlower power consumption, and higher frequencies. Scaling down transistor\ndimensions alone in a planar manner is no longer sufficient to sustain Moore's\nLaw. Semiconductor technology must move towards three-dimensional\nintegration, as well as make breakthroughs in new structures, new materials, and\nnew processes.\nSemiconductor technologies development has entered the era of 3D system\nscaling, which involves three-dimensional transistors and memory cells, and\nheterogeneous 3D integration. Taiwan's semiconductor technology must continue to advance in order to meet future technological challenges.\nThe goal of this proposal is to help overcome the technical bottlenecks, to help\nTaiwan\u2019s industry advancing semiconductor technology by conducting earlystage\nresearch of several key technologies at university while developing\nsemiconductor talents and research skills in Taiwan.\nIn this proposal, we address new materials, new structures, and new\napplications with six research themes:<\/p>\n<\/div><\/div><\/div>

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Theme 1<\/p>\n<\/div><\/div><\/div>

IC Transistor stacking with versatile channels and gates<\/p>\n<\/div><\/div><\/div><\/div><\/div>

Theme 2<\/p>\n<\/div><\/div><\/div>

Ferroelectric HZO Materials and Devices<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Theme 3<\/p>\n<\/div><\/div><\/div>

2D\/1D semiconductor devices targeting 2030 technology<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Theme 4<\/p>\n<\/div><\/div><\/div>

Future Semiconductor packaging technologies<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Theme 5<\/p>\n<\/div><\/div><\/div>

Three-dimensional high-density oxide CMOS devices and applications<\/p>\n<\/div><\/div><\/div><\/div><\/div>

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Theme 6<\/p>\n<\/div><\/div><\/div>

Future GaN power HEMTs for ubiquitous satellite transceivers<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div>

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